> Soldering & Desoldering > Solder Paste & Fluxes

Unique Selling Points 1. Shelf life 9 months instead of 6 months Date of manufacturing on the packing 2. Stencil life = paste on stencil - relative humidity 40-60% - temperature 20-25°C => 24h-48h 3. Board life = paste on PCB - time between paste printing and final component placement - relative humidity 40-60% - temperature 20-25°C => 24h-48h 4. Tack time - time that the eC-solderpaste keeps its tackiness = more than 8h after printing 5. PiP - suitable for pin-in-paste technology 6. Guaranteed Halogen free ROL0 = Rosin - Low activity - 0 Halogen Halogen - IPC standard = 500 ppm - European standard = 100 ppm - eC-solderpaste = 0 ppm 7. 140Gr Jar instead of 500Gr Jar - less waste - more economic price 8. no clean solder paste