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Forced air convection reflow oven MR260

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. All heating parameters and registered profiles can be easily observed on built-in 17" LCD display. 

By eliminating set-up time your production line can work to its fullest capacity.

 

 

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Description : eC-reflow-mate-hood The eC-reflow-mate-hood is an add-on to our eC-reflow-mate oven V3 which removes soldering fumes when the oven door opens after reflow. How does it fit? The hood clips onto the top of the oven as shown. It projects beyond the back of the oven to allow connection to an existing fume extraction system via a standard 50.1 mm or 76.4 mm tube. The hoods are supplied with two connectors, one for each of the two standard tube sizes. How does it work? 1. Connect the hood to the extraction unit and switch it on. 2. When the door opens after soldering, a simple lever on the hood holds the drawer under the hood slot so that the fumes can be extracted. 3. Once this is done, depress the lever to release the drawer and unload the PCB in the usual way. Notes: 1. V3 ovens have the serial numbers: 12090223 - 12090362 and 14040001 upwards. 2. If you don't have an existing extraction system we offer a suitable unit : check out the 'eC-fumecube' below.
195,00 €
The eC-reflow-mate reflow oven gives an even temperature across the board under total user control throughout the soldering process. The eC-reflow-pilot software allows the user to define and store an unlimited number of temperature and time profiles and to monitor the exact process for each board. Separate sensors can be used to measure and display the temperature profile on the actual PCB - order eC-reflow-mate now
2 995,00 €
Unique Selling Points 1. Shelf life 9 months instead of 6 months Date of manufacturing on the packing 2. Stencil life = paste on stencil - relative humidity 40-60% - temperature 20-25°C => 24h-48h 3. Board life = paste on PCB - time between paste printing and final component placement - relative humidity 40-60% - temperature 20-25°C => 24h-48h 4. Tack time - time that the eC-solderpaste keeps its tackiness = more than 8h after printing 5. PiP - suitable for pin-in-paste technology 6. Guaranteed Halogen free ROL0 = Rosin - Low activity - 0 Halogen Halogen - IPC standard = 500 ppm - European standard = 100 ppm - eC-solderpaste = 0 ppm 7. 140Gr Jar instead of 500Gr Jar - less waste - more economic price 8. no clean solder paste
39,00 €
Description : Flexible, easy to use software controlling all aspects of the reflow soldering operation preheater: · set temperature: sets the temperature of the preheat stage. · follow act. temp. program: the preheat stage follows the temperature of the main heat stage with the defined offset. · temperature correction: sets the offset between main and external sensor. This offset is also displayed. · reflow hold time: sets the duration of the maximum temperature as defined in the profile. After this temperature is reached it will be held for the specified time. Download – File transfer from the eC-reflow-mate to the eC-reflow-pilot. Upload – File transfer from the eC-reflow-pilot to eC-reflow-mate. COM-Port setup. On first operation, the valid COM port will be shown. If this is not the case, check the control panel / device manager for the suggested COM Port and input the port number in the eC-reflow-pilot options – select serial port in drop-down menu. Temperature points in the profile can be hidden by dragging them to the beginning of the timeline. Global parameter should only be changed by the manufacturer or after consultation.
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